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Content

Based on LTCC Technology

ACX has the ability to produce a variety of RF front-end devices and modules using LTCC technology. We offer in-house  LTCC tape systems, which are compatible with DuPont and Ferro tape systems.

 

LTCC Modules - Foundry Service

ltcc 2D modules
ltcc 3D modules
 

Properties of ACX's LTCC material compared with those of commercial materials

Characteristics ACX DuPont 951 Ferro A6M
Dielectric Constant (@ 3GHz) 7.5 7.8 5.9
Dielectric Loss (@ 3GHz) < 0.33% 0.43% 0.20%
TCE (25-300°C) (ppm/°C) 4.7 5.8 7.0

Design Rules

ltcc 設計圖
ITEM Standard (mm) Advanced (mm)
(A) Via diameter 0.125, 0.1801 Flexible (Min. 0.06)
(B) Min. via cover pad Via?. + 0.03 Via?. + 0.02 
(C) Min. via diameter / pitch (Flip chip) 0.125/ 0.260 0.060 / 0.180
(D) Min. spacing from via cover pad to line 0.10 0.08
(E) Min Line width Nominal 0.10 0.05
Mean value tolerance ± 0.015 ± 0.010
(F) Min. line spacing 0.10 0.08
(G) Min. spacing from via cover pad to substrate edge 0.15 0.10
(H) Min. spacing from conductor to substrate edge 0.15 0.10
(I) Min. dimension for extended terminal 0.10 0.08
(M) Min. spacing from ground plane to substrate edge 0.15 0.10
(N) Feed thru spacing 0.15 0.10
Conductor thickness Nominal 0.013 0.010 (Fine-line printing)
Tolerance ± 0.003 ± 0.002
Tape thickness Without stacked conductors2 0.024 0.035 0.046 0.052 Flexible (Min/Max: 0.015/0.133)3
0.094 0.104 0.129 0.147
With stacked conductors 0.020 0.030 0.040 0.045
0.080 0.090 0.115 0.133
Tolerance3 Thickness 30.080 ± 7 % ± 5 %
Thickness <0.080 ± 5 % ± 3 % (Min. ±0.002)
Substrate thickness Max. 1.6 2.4
Min. 0.5 0.3
Tolerance ±7%(min± 0.075) ±5%(min ± 0.050)
Camber < 0.3% < 0.2%
Number of layers Up to 20 Up to 30
Layer to layer alignment tolerance ± 0.050 ± 0.025
Max. panel & array size Max 55 x 55 110 x 110
Tolerance ±0.5%(Min. ±0.200) ±0.2%(Min. ±0.100)

1All the dimensions are measured after firing.

2Tape thickness is subject to change with stacked conductors at the adjacent areas.

3Based upon the tape thickness with stacked conductors.